Ultra-thin chip packaging method and packaged body

The invention provides an ultra-thin chip packaging method and a packaged body. The ultra-thin chip packaging method comprises the following steps: providing a wafer, wherein the surface of the wafer is provided with a plurality of chip structures to be packaged; thinning the back surface of the wafer; adhering a conductive thin film which is sticky on two surfaces to the back surface of the wafer; cutting the wafer into independent chips; and adhering the chips to a lead frame. The invention also provides a packaged body comprising a lead frame and chips, the chips are arranged on the lead frame, and the lead frame and the chips are adhered together through a layer of conductive thin film. The invention has the advantages of avoiding the serious warpage of the chips due to the growth of the metal layer on the thinned wafer, simplifying the ultra-thin chip packaging process and preventing the lead frame from deforming or leaking resin at high temperature.