Die Attach Adhesives and Films

This chapter outlines the strong correlation between developments in electronic packaging technologies and required properties of die attach materials. An overview of die attach materials is summarized with the trends in the market. Die attach paste, adhesive tape for a lead on chip (LOC), die attach film, and the prospects of advanced die attach film are described in each section. The technical requirements of the die attach materials, which include high purity, fast curing, low stress, high package crack resistance, and multi-chip packaging are discussed.