Coating material, the pattern forming method and a method of manufacturing an electronic device

Coating material is for forming a pattern having a highest point ejected in the area from the center within 20% of droplet ejection, the raw material and the solubility parameter SP value of 20.3 MPa Pattern forming method uses the coating material to form the above pattern. Method of manufacturing an electronic device, at least a layer of electronic device is manufactured by a film forming pattern by using the pattern forming method.