Film for back surface of semiconductor

The purpose of the present invention is to provide a protective film for a semiconductor, with which it is possible to prevent warpage of semiconductor wafers and semiconductor chips and to prevent chipping and reflow cracking from occurring. This protective film for a semiconductor is characterized by comprising a metal layer to be laminated onto the back surface of a semiconductor chip and an adhesive layer for affixing the metal layer to the back surface of the semiconductor chip, and is characterized in that the surface free energy of a surface of the adhesive layer on the side to be affixed to the semiconductor chip and that of a surface of the adhesive layer on the side to be affixed to the metal layer are both at least 35 mJ/m 2 , and the peel force between the adhesive layer and the metal layer in a B stage is at least 0.3 N/25 mm.