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Reducing Cracking in Solder Joint Interfacial Cu 6 Sn 5 with Modified Reflow Profile
Reducing Cracking in Solder Joint Interfacial Cu 6 Sn 5 with Modified Reflow Profile
2020
Flora Somidin
Stuart D. McDonald
Xiaozhou Ye
Dongdong Qu
Keith Sweatman
Tetsuya Akaiwa
Tetsuro Nishimura
Kazuhiro Nogita
Keywords:
Soldering
Cracking
Materials science
Metallurgy
Microstructure
Correction
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