Flexible electronic assembly and process

This disclosure relates to devices, systems and methods for manufacturing a flexible microelectronic assembly. In one example, a polymer is formed on a microelectronic component, the polymer takes the form after forming a substantially rigid state. A conductive layer with respect to the micro-electronic component and the molded polymer is formed, wherein the conductive layer includes traces that are electrically coupled to the microelectronic components. An action is applied to the polymer molding, after which the polymer form to change from a generally rigid state to a flexible state in principle.