Structure and wettability control of Cu–Ni–P alloy synthesized by electroless deposition

Abstract Cu–Ni–P alloy with unique microstructures were deposited by electroless plating. The effect of deposition parameters on the morphology, crystallographic texture and hydrophobic property of the as-prepared alloy was investigated. SEM observation reveals that the morphology of Cu–Ni–P deposits can be controlled by adjusting Ni 2+ concentration, temperature and pH value. Cone structure with dimensions of about 5 μm in height and 0.5 μm in root diameter could be obtained by optimum parameters of 0.0024 M Ni 2+ , 70 °C, pH 9, 0.05 M sodium citrate and 50 ppm PEG10000 (or 4000). XRD results show that Cu–Ni–P cone structure is well-crystallized and exhibits strong (1 1 1) texture. When the concentration of Ni 2+ and OH − increases, the surface of Cu–Ni–P coating is comparatively smooth and shows a preferred orientation of (2 2 0). Static contact angles were measured to investigate the surface’s wettability. The results reveal that Cu–Ni–P alloy with dense cone structure is hydrophobic with maximum static contact angle of 140°, while that of flat Cu–Ni–P alloy is 93°.