Surface Control of Bottom Electrode in Ultra-Thin SiN Metal–Insulator–Metal Decoupling Capacitors for High Speed Processors

Highly reliable metal–insulator–metal (MIM) capacitor with ultra-thin SiN dielectrics is developed on the surface-controlled bottom electrode in nanometer-scales. Coverage of the TiN bottom electrode with a Ta thin layer achieves smooth surface. In addition, this electrode structure exhibits excellent etching controllability even for the MIM with the ultra-thin SiN dielectrics. The smooth surface of the Ta/TiN stacked electrode improves the dielectric characteristics such as leakage, breakdown and time-dependent dielectric breakdown (TDDB) reliability in the MIM capacitors, integrated into Cu dual-damascene interconnects (DDIs). As a result, the SiN-MIM with the Ta/TiN bottom electrode achieves high capacitance of 7 fF/µm2 as well as high reliabilities, which are 20% higher breakdown field and 6000 times longer TDDB lifetime than that without Ta-insertion. These values guarantee the high performance operation for more than 10 years under the environment at 85 °C.