Integration and modeling of photonic devices suitable for high performance computing and data center applications

We report a 200 mm silicon photonic platform integrating a set of devices dedicated on HPC applications. PiN microring modulator layout and process are optimized together. Active tuning through heating section is investigated using either doped silicon or metal resistors. This technology is supported by a dedicated process design kit (PDK) compatible with conventional CMOS EDA tools. The PDK includes optical device models that will be described and compared with experimental results. A focus will be done on the PiN micro-ring modulator models which covering a wide range of geometries. DC mode and RF behaviors are supported.