Development ofMultilayer Organic Modules forHermetic Packaging ofRFMEMS Circuits

We present thedesign anddevelopment ofamulti- layerorganicmodulethatcan integrate Micro-Electro- Mechanical Systems (MEMS)intoaSystem-in-a-Package (SiP). A cavity formedinLiquidCrystal Polymer(LCP)hasbeen laminated, atlowtemperature, ontoaMEMS silicon switch to createa hermetically sealed package.Multi-layer organic dielectrics canbeintegrated ontopofLCP films toforma3-D SiPmodule.Theentire SiPhermetically sealed package hasa total insertion loss of40.1 dBatX-band.Thepackage also passes Method1014, MIL-STD-883 grossleakandfine leakhermeticity tests. We havedemonstrated a 2-bit RF MEMS TTD (True- TimeDelay)switched linephaseshifter inthismulti-layer organic module.Thephaseshifter achieves anaverage insertion loss of1.8dB/bit, withless than3°phaseshift variation. IndexTerms- Liquid Crystal Polymer, Hermeticity, Phase Shifter.