Metal CMP: Perfecting surfaces

This paper presents the development of CMP process optimization in order to obtain very good bondability of tungsten wafers. Surface quality of polished tungsten wafers under different conditions is analyzed through statistical tools like standard deviation, skewness and kurtosis. Good surface quality for planarized wafers is obtained by polishing under optimized conditions process, allowing highly improved bonding quality, as shown by Scanning Acoustic Microscopy.