Polymer flip-chip bonding of pressure sensors on flexible Kapton film for neonatal catheters

A new polymer flip-chip bonding method on a flexible Kapton film has been developed and applied to dual lumen neonatal catheters integrated with silicon micro pressure sensors. This polymer flip-chip bonding technique requires a low temperature process, which is very desirable for mounting microsensors or microactuators on flexible polymer substrates for medical applications. The silicon micro pressure sensors, which are mounted on a flexible Kapton film with metal lines for neonatal catheter, have been fully characterized in both gas and liquid.