Low-temperature diffusion bonding method for adding quasi-crystal interlayers to aluminum-steel-aluminum

2014 
The invention discloses a low-temperature diffusion bonding method for adding quasi-crystal interlayers to aluminum-steel-aluminum. The method includes the main steps that quasi-crystal aluminum silicon copper middle transition alloy foil sheets are arranged between contact interfaces to be welded of aluminum plates and contact interfaces to be welded of a low-carbon steel plate, vacuum diffusion bonding is conducted, processing parameters are that the bonding temperature is controlled in the range of 420 degrees to 490 degrees, the heat preservation time under the bonding temperature ranges from 15 min to 25 min, the pressure ranges from 0.3 MPa to 0.9 MPa, and the vacuum degree is 1.33*10 Pa-1.33*10 Pa. By means of the method, low-temperature diffusion bonding of the aluminum and the low-carbon steel can be achieved, the diffusion interfaces of the formed aluminum-steel-aluminum composite structure is firm in combination, reliable in bonding quality and high in production efficiency. The low-temperature diffusion bonding method for adding the quasi-crystal interlayers to aluminum-steel-aluminum has the advantages of being precise in processing parameter control, low in cost and the like, and the bonding temperature can be reduced.
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