THERMAL TRANSFER PRINTING TECHNIQUE FOR ELECTRODE PATTERNING IN COFIRED CERAMIC MULTI-LAYER DEVICES
1994
A new mask-less electrode patterning method using a thermal transfer printing technique was investigated. Thermal ink ribbons were prepared, which included more than 50 vol. % conductive metal powder. Arbitrary electrode patterns were designed with a computer and printed out on a ceramic green sheet with a serial thermal printer. The ceramic green sheets with printed electrode patterns were stacked up and cofired to obtain a multi-layer ceramic capacitor.
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