Device manufacturing method using the semiconductor manufacturing apparatus and the manufacturing apparatus incorporating the inspection system

The chemical mechanical polishing apparatus for sample such as a wafer (100), is built inspecting device (25). Polishing apparatus (100) further comprises a load unit (21), a chemical mechanical polishing unit (22), cleaning unit (23), a drying unit (24) and unloading unit (26). Chemical mechanical polishing device (100), prior to receiving the sample from step (107), performs the processing by the respective units of the polishing apparatus (100), and sends the processed sample to the next step (109). Samples loading means and Sample unloader means and transport means to move between the units is not required.