Systematically Integrated Phased-Array Antenna Configuration to Enhance Beam Coverage Efficiencies of Millimeter-wave 5G Mobile Devices

This paper presents a hybrid packaging method of integrating multi-phased array modules to maximize the user equipment’s spherical coverage while incorporating future device design trends. The previously reported antenna-on-display (AoD) technology is coherently combined with the antenna-in-package (AiP) solution to enhance the beam-coverage using efficient packaging and system configuration strategy. To demonstrate the concept, the fabricated 28 GHz V-pol PFSA array module and display-integrated phased array module achieve more than 850 MHz impedance bandwidth across the 3GPP’s licensed n261 (27.5 – 28.35 GHz) bands. Over-the-Air (OTA) testing of the fabricated active phased arrays confirms the maximum peak EIRP of more than 14 dBm and the 3-dB scanning angle of more than ± 22.5° at 28 GHz.