Pd+2/Poly(acrylic acid) Thin Films as Catalysts for Electroless Copper Deposition: Mechanism of Catalyst Formation
1990
The mechanism involved in the initiation of electroless copper deposition onto dielectric substrates using Pd +2 /poly(acrylic acid) thin films is described
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
40
Citations
NaN
KQI