High-quality-factor differential inductor structure and manufacturing process therefor

The invention discloses a high-quality-factor differential inductor structure and a manufacturing process therefor. The differential inductor is positioned in a circular ring through silicon via array and divides through silicon vias in the circular ring into a left side and a right side, including a first through silicon via, a second through silicon via, a third through silicon via, a fourth through silicon via, a fifth through silicon via and a sixth through silicon via from the top to bottom; and the through silicon vias are subjected to connection of a metal layer and a re-layout layer according to design requirements. According to the manufacturing process, a groove is formed in a silicon substrate in a digging manner through a bosch process so as to reduce the loss of the silicon substrate; the three-dimensional differential inductor is configured through the through silicon via array in the circular ring; and the inductance value is increased due to the coupling (the flowing directions of the current in metal lines in the metal layer and the re-layout layer are opposite to each other) of the interior of the differential inductor and a relatively small effective area.