Through Mold Interconnection assessment for advanced Fan Out Wafer Level Packaging applications

This study demonstrates the process feasibility and electrical performances of Through Mold Interconnections (TMI) integrated in a Fan Out Wafer Level Packaging (FOLWP) configuration. With an interesting aspect-ratio, a low pitch and a small diameter, the TMIs are assessed thanks to the connection to two Redistributions Layers (RDL) on each side of a chip embedded in an Epoxy Molding Compound (EMC). Single interconnection and several daisy chains have been electrically characterized and show low interconnection resistance.