Method for metallizing with copper

Method for the metallization of copper in a plating bath in which the substrate is contacted with a leveling additive before and / or during the metallic copper and wherein the leveler additive is selected from molecules according to formula (I) ** ** Formula wherein Y is - (CH2) -; n ranges from 1 to 3; R1 and R2 are independently selected from hydrogen and C1 to C4 linear and branched, R3 is selected from hydrogen, C1 to C4 linear and branched, lithium, sodium, potassium and ammonium; A is an unsubstituted tetrazole and triazole heterocyclic moiety selected from unsubstituted.