Development of a High Temperature Interconnect Solution as an Alternative to High Lead or Gold Content Solders

2016 
Abstract A collaborative research programme between project partners Microsemi, the National Physical Laboratory (NPL) and Gwent Electronic Materials (GEM), has successfully developed innovative materials specifically designed to offer an alternative for high Pb or Au content materials to increase the operating temperature of electronic assemblies. Currently, for electronic assemblies to operate at high temperature, they must use a high lead solder or a very expensive gold based solder to withstand these temperatures. The ELCOSINT project has developed an inexpensive lead-free alternative for joining high temperature electronics suitable for operating at temperatures above 250°C utilising standard surface mount assembly processes. This paper summarises the work undertaken by the authors to develop and better understand this new family of electrical interconnection materials. The project brought together a materials supplier (GEM – Gwent Electronic Materials), an end-user (MSL - Microsemi) and an technolog...
    • Correction
    • Source
    • Cite
    • Save
    • Machine Reading By IdeaReader
    4
    References
    0
    Citations
    NaN
    KQI
    []