PEB bake optimization for process window improvement of mixed iso-dense pattern

We have shown that process effects induced by extending the post-exposure bake temperature in the process flow of chemically amplified photoresists can lead to significant improvements in depth-of-focus (DOF) and exposure latitude (EL) and small geometry printing capability. Due to improved acid dose contrasts and a balanced optimization of acid diffusion in the presence of quencher, PEB temperature increase has enabled the printing of iso and semi-dense space of 0.2 ?m and below with a large DOF, using binary masks and 248 nm lithography without expensing the iso-dense bias. The results and findings of a full patterning process in a device flow, with different PEB temperatures as a process enhancement, are presented. The main objective of this study is to demonstrate how, using KrF lithography with binary masks and no optical proximity correction (OPC) nor other reticle enhancement technique (RET), the process latitude can be improved. Lithographic process latitudes, intra-field critical dimension (CD) uniformity and resist profiles of different PEB processes are evaluated. Then, the after-etch profiles are also investigated to ensure the feasibility of this technique.