Led device and manufacturing method

Object of the present invention is to provide an even capable of suppressing coloring of the encapsulating material at high temperature and humidity environment, suppressing reduction in luminous efficiency of LED devices. LED apparatus of the present invention comprises: a substrate; disposed on the substrate, an LED element; covering the LED element with respect to the parts of the silicone resin 100 weight containing 0.005 part by weight or more, the cerium oxide cerium oxide 0.03 parts by weight or less dispersed composition layer ; and a cover layer of cerium oxide-dispersed silicone resin composition (4).