Organic component and process for its preparation

It is a component is provided having a first substrate (1) and a second substrate (2). On the first substrate (1) at least one optoelectronic component (4) is arranged, which contains at least one organic material. The first substrate (1) and the second substrate (2) are arranged relative to each other such that the optoelectronic component (4) between the first substrate (1) and the second substrate (2) is arranged. Further, a bonding material (3) is arranged between the first substrate (1) and the second substrate (2) which surrounds the optoelectronic component (4) like a frame and first and second substrates (1, 2) mechanically connecting. The bonding material (3) has been softened by means of an exothermic chemical process a reactive material (7) for mechanically connecting the substrates (1, 2). Further, a method for producing such a component is specified.