Chip bonding apparatus and method

A chip bonding apparatus comprises a first motion stage (110), a second motion stage (200), a chip pickup means (160), a transition carrier (170), a chip adjustment system (1000), a bonding stage (420), and a control system (500). A chip boding method comprises: temporarily bonding a chip by means of a transition carrier (170); accurately adjusting the position of the chip on the transition carrier (170) by means of a chip adjustment system (1000); and bonding the chip on the transition carrier (170) to a substrate (430) in one step. The method implements batch bonding of chips, and greatly improves the efficiency of the flip chip bonding process. By means of batch pickup and batch bonding of chips, the time for chip pickup, the time for accurate chip position adjustment, and the time for chip bonding are balanced, so that the bonding accuracy of the bonding device can be ensured and also the productivity is improved.