Multi-focus femtosecond laser scribing method applied to separation of light emitting diode (LED) device

The invention discloses a multi-focus femtosecond laser scribing method applied to separation of light emitting diode (LED) device. The multi-focus femtosecond laser scribing method comprises the following steps of: fixing a prepared LED device on a horizontal mobile platform and positioning the prepared LED device in an imaging center of charge coupled device (CCD) imaging equipment; 2, placing a plurality of lenses on a laser light path of a femtosecond laser, and dividing laser into a plurality of focuses; 3, focusing the focuses on parts in a substrate of the LED device at different depths; 4, transversely and longitudinally moving the horizontal mobile platform, and performing femtosecond laser scribing; and 5, shredding the LED device to obtain a single LED device. By the multi-focus femtosecond laser scribing method, a sapphire substrate can be cut by different light beams simultaneously, and effects that the substrate is cut at one time, and a plurality of scratches are caused are achieved, so that a relatively thick sapphire substrate is cut in a mode that low damage is caused, and the LED device is separated.