Adhesive of high heat conduction low resin mica tape and preparation method thereof and low resin mica tape

The invention discloses adhesive of high heat conduction low resin mica tape and preparation method thereof and low resin mica tapes, the raw material of adhesive includes epoxy resin, modified manometer silicon dioxide/boron nitride and Organosilicon Alcohol in Organic, modified manometer silicon dioxide/boron nitride is the mixture of modified manometer silicon dioxide and modified boron nitride, and modified manometer silicon dioxide and modified boron nitride are obtained by modified polyisocyanate nano silicon dioxide and boron nitride respectively；Organosilicon Alcohol in Organic contains silicone hydroxyl, phenyl and vinyl；Preparation method：Modified manometer silicon dioxide/boron nitride is first prepared, is then prepared itself and epoxy resin and Organosilicon Alcohol in Organic hybrid reaction；Using：It is used to prepare low resin mica tape, can be used for high heat conductive insulating impregnating resin（Paint）；The adhesive of the present invention and there is the mechanical electrics performance such as preferable heat-conducting effect and heat resistance, dielectric loss and voltage ageing with the low resin mica tape of its preparation, and then is particularly suitable for the insulation system of large and middle size motor.