Improved disk cell for a plurality of pressure-contact semiconductor devices

The invention relates to a disc cell (1) for pressure contacting a plurality of semiconductor components by means of a clamping force (F) generating clamping means (4, 13) comprising: a housing (2, 3, 7, 8); at least one first recorded in the housing semiconductor device (6) of the first type; at least one second recorded in the housing semiconductor device (5) second, different to the first type; wherein the housing (2, 3, 7, 8) at least one comprises the first (6) and second (5) semiconductor device across substantially perpendicular to the clamping force (F) oriented metallic printing plate (2) for clamping the first and second semiconductor device wherein the pressure plate (2) is configured such that the clamping force (F) is locally limited (9) acting on them, to clamp over the printing plate (2), the first (6) and second (5) semiconductor devices, wherein the first semiconductor component ( 6) is arranged below the local Einwirkbereichs (9) of the clamping force (F) and the second component (5) at least partially outside of the local Einwirkbereichs (9) is arranged.