Development and challenges of copper wire bonding technology

With the fast development in recent years,fine pitch wire bonding is the main trend of copper wire bonding.The measures to overcome Cu oxidation and the optimization of bonding parameters are introduced,and the reliability mechanism from the view of IMC growth and pad Al squeeze are described.According to the new requirements while applying Cu wire to fine pitch wire bonding,the properties of Pd-coated Cu wire are introduced,and the characteristic of Cu wire looping and its challenges are expounded.