Fabrication of Sn-Ag/CeO 2 Electro-Composite Solder by Pulse Electrodeposition

The Sn-Ag/CeO2 nanocomposite solders have been pulse electrodeposited from an aqueous citrate bath containing varying concentrations of CeO2 nanopowders (1 to 30 g/L). Microstructural characterization, hardness, melting point, electrical conductivity, wear resistance, and residual stress measurement of the composite coatings indicate that the composite deposited from an electrolyte containing 15 g/L CeO2 possesses the optimum properties and thus can have potential applications in solder joints and packaging.