Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module

When a conductive resin assembling an electronic device, a conductive resin containing a specific component as a diluent conductive resin, or applying a specific component in the diluent before the conductive resin is cured. Thus, the electronic device electrode (4) (5) of the circuit board (1), (2) by opposite portions of the conductive filler as a main component resin (3a) connected to an electronic device (4) and an electrode below around (5) is connected to the binder resin flowing through the resin from the conductive resin as a main component (3b, 3c). In the binder resin as a main component by means of a resin (3b, 3c) increase the connection strength.