The novel method of adhesive bonding in technology of semiconductor fluidic systems

The subject of this paper is to describe the novel method of substrates bonding applied in MEMS technology. This method gives a possibility of carrying out bonding processes in standard devices for wafer bonding. It can be applied to chemical, high voltage or high temperature sensitive surfaces. It can be used for bonding substrates with deep etching area with sharp edges and covered with films characterized by low adhesion to the classical materials exploited for photolithography. The main idea of the method is based on two various polymer materials usage. The first material enables to define accurate borders of bonding area, whereas the other guarantees suitable parameters of bonding: firstly the exact adhesion and a stable join and secondly, desirable electrical or thermal parameters.