Elongated bump structure in the package structure

The present invention discloses a package structure elongated bump structure in which the package comprises a chip attached to a substrate. Chip includes a bump structure, which includes a major axis measured along the length of the conductive pillar (L) and a width along the minor axis of the conductive pillar measured conductive post (W) is. The substrate and the mask layer comprising a pad region located above the pad region, wherein the mask layer has an opening exposing part of the pad region. Die attached to the substrate to form an interconnection between the conductive pillar and the pad region. An opening having a first dimension along a major axis measured (d1) and a second dimension along a minor axis measured (d2). In one embodiment, L is greater than d1, and W is less than d2.