Integration of laser-annealed junctions in a low-temperature high-k metal-gate MISFET

Integration and properties of devices processed by excimer laser annealing are presented. The best results are achieved by shallow implantations into a native-oxide-free silicon surface and laser annealing with the remainder of the device protected by an Al reflective layer. Low-temperature MISFETs are fabricated with a metal-gate high-k gate stack of PECVD SiO 2 and ALD Al 2 O 3 with an EOT of 9.2 nm and an Al-gate. The source/drain regions are self-aligned to the metal gate, which also serves as a laser masking reflective layer. Ablation of the masking layer is prevented due to the low thermal resistance of the thin underlying gate dielectric. The measured devices exhibit good current drivability, which improves with higher laser energy. The maximum processing temperature of the presented MISFETs is 400°C and can potentially to be reduced down to 300°C.