Wafer cracking device

The invention discloses a wafer cracking device. The wafer cracking device is characterized by comprising a support table, wherein the shape of the support table is matched with the shape of a wafer; the support table is provided with at least one first groove; and each first groove is communicated with at least one vacuum tube. Through adoption of the wafer cracking device, collision with a film stretching frame can be avoided; the wafer does not need to be transferred onto a film stretching frame with a larger inner diameter before cracking of the wafer; the process is simplified; and the production efficiency is increased. Meanwhile, the using quantity of films for sticking wafers is saved, and the production cost is lowered.