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CERAMIC MULTICHIP MODULE AND HIGH-DENSITY THICK FILM INTERCONNECT TECHNOLOGY
CERAMIC MULTICHIP MODULE AND HIGH-DENSITY THICK FILM INTERCONNECT TECHNOLOGY
1998
R.E. Cote
S. J. Horowitz
J. W. Lawson
Keywords:
Ceramic
Electronic engineering
Materials science
Optoelectronics
interconnect technology
high density
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