Disassembling method of disassembling apparatus and a backlight module

An apparatus and a method for dismantling a backlight module dismantling, disassembling the method comprising: a liquid crystal panel and the backlight module includes a liquid crystal module to each other by the adhesive portion facing the connector is placed on a support table; cutting the wire portion into the gap between the liquid crystal panel and the backlight module, the wire cutting section comprises a cutting line between the two end portions and said two end portions, both end portions of at least one of between the liquid crystal module and the relatively movable; and by the wire cutting section cutting force is applied along the surface of the adhesive portion of the adhesive portion is located, to the liquid crystal panel from the backlight module split open. The method can reduce the force of the backlight module during dismantling suffered, reduce the risk of damage to the backlight module.