Isotropous thermosetting conductive adhesive film and preparation method thereof

The invention relates to isotropous thermosetting conductive adhesive film and a preparation method thereof. A thermosetting conductive adhesive is composed of, by weight, 3%-5% of polyester resin, 4%-7% of hydroxy acrylic resin, 2.5%-6% of epoxy resin, 12%-19.5% of conducting media, 0.1%-0.5% of thixotropic agents and 62%-77.7% of solvent. The preparation method of the adhesive film comprises the steps that a release liner is coated with the prepared thermosetting conductive adhesive liquid, the temperature of a drying channel is controlled to be 80 DEG C to 120 DEG C, coating speed ranges from 10 m/min to 15 m/min, the thickness of the adhesive ranges from 25 microns to 30 microns, and the isotropous thermosetting conductive adhesive film is obtained by attaching the release liner to the thermosetting conductive adhesive film in the winding process. The conductive adhesive film is good in conductivity, small in resistance change rate, large in peeling strength and good in operating performance, and can be stored for more than 30 days at room temperature.