Metal foil, metal foil with mold release layer, laminate, printed wiring board, semiconductor package, electronic device and method for producing printed wiring board

Provided is a metal foil which is provided with a mold release layer, thereby enabling physical separation of a rein base in cases where the metal foil is bonded to the resin base, and which is removed at a low cost without deteriorating the profile of the metal foil surface transferred to the surface of the resin base in a process wherein the metal foil is removed from the resin base. This metal foil also enables bonding of resins, which contain different resin components, with good adhesion. A metal foil that has a surface profile with respect to which the value of formula (1) is 2-9. In formula (1), X is the number of metal particles per a straight line having a length of 10 μm (particle density = particles/10 μm) when an SEM image of at least one surface of the metal foil is obtained at a magnification of 3,000, and then a straight light is drawn on the SEM image and the number of metal particles in contact with the straight line are counted; and Y is the roughness Rz of the metal foil surface.