Metallic packing and preparation method thereof, electric conduction and thermal conduction sizing agent and glue capable of low-temperature sintering and preparation method thereof
2017
The invention relates to a preparation method of a metallic packing. The method comprises the following steps: preparing low-melting-point metal salt, a complexing agent and a pH conditioning agent with water into a chemical plating solution; and mixing metal powder with the obtained chemical plating solution, adding a reducing agent, heating to carry out chemical plating, and carrying out solid-liquid separation to obtain the metallic packing. According to the preparation method and electric conduction and thermal conduction sizing agent and glue capable of low-temperature sintering prepared by adopting the metallic packing, low-temperature sintering of the packing can be effectively realized, metallurgical contact of the packing is realized, a three-dimensional communication network is constructed, the thermal conduction and electrical conduction performances are improved, the cost is effectively reduced, and large-scale industrial production is facilitated.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI