Preparation of RPSL-01 Type Photosensitive Resin for Stereolithography and Study on its some Properties

RPSL-01 type photosensitive resin for Stereolithography was prepared with 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate (UVR 6110), bisphenol A type epoxy diacrylate (EA-612), tripropylene glycol diacrylate (TPGDA), pentaerythritol triacrylate(PETA), triethylene glycol divinyl ether (DVE-3), benzil dimethyl ketal (Irgacure651) and a mixture of triarylsulfonium hexafluoroantimonate salts (UVI-6976) as raw materials. Some properties of the photosensitive resin were investigated. The viscosity of the photosensitive resin at 30°C was 425mPa.S, The glass transition temperature (Tg ) of the UV-cured specimen was 47°C, and the weight loss of the UV-cured specimen at 200°C was less than 5%. The photosensitive resin and its UV-cured specimen were also characterized by infrared (IR).