Electronic packaging structure and the bump junction structure and manufacturing method

The present invention discloses a bump structure, comprising a substrate, a pad, electrode and a protruding electrode. The pads disposed on the substrate. The electrode is made of a first metal material and disposed on the bonding pad. The second protruding electrode is made of a metal material and disposed on the electrode, wherein the cross-sectional area smaller than the cross-sectional area of ​​the projecting electrodes of the electrode.