Integration using the hybrid silicon platform
2009
A brief review of recent progress in photonic integrated circuits (PIC) and connection to the electronic IC roadmap is presented. High-quality wafer bonding, electrically pumped lasers and high speed modulators are essential technologies for high speed interconnects and mass production of optoelectronics.
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
0
References
1
Citations
NaN
KQI