Laminated structure, a method of manufacturing a laminated structure, the electronic device

The present invention discloses a laminated structure, a method of manufacturing a laminated structure, an electronic device. Wherein the laminated structure comprises: a first substrate, an adhesive, a second substrate and the graphene. Adhesive disposed on the main surface of the first substrate, and the storage elastic modulus of the adhesive at 23 ℃ or more and 7.2 × 104Pa to 6.1 × 105Pa or less. The graphene bonded to the adhesive, and the layer or layers having graphene. The second substrate is bonded to the graphene.