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Acemap > Paper > Ni-Sn 液相拡散を用いた半導体ダイアタッチ接合体の冷熱サイクル信頼性に与えるAl 中間層の効果

Ni-Sn 液相拡散を用いた半導体ダイアタッチ接合体の冷熱サイクル信頼性に与えるAl 中間層の効果

2021 
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