The molding die assembly and sealing material

The present invention discloses a molded closure assembly and the molding compound, the molding assembly including the substrate and stacked thereon the first mold member and a sealing member sealing the second mold, the first or second mold members each having a semiconductor element sealed located around the semiconductor element warp suppressing structure, covering the semiconductor element and the warp suppressing molding compound structure, and the semiconductor element, the molding material and the warp suppressing layer on the protective structure. A molded sealing material, comprising a main body and disposed in the body of the warp suppressing structure, the warp suppressing structure comprises an annular portion located on the edge of this body, the grill is located inside of the annular portion and the annular portion connected to the grid connection. Accordingly, the present invention can prevent warpage of the molding assembly produced in a manufacturing process.