Bump-connecting and contact bumps and processes for making a contact bump bonding

The invention relates to a bump interconnect (24) and a method for manufacturing a bump connection between a with at least one first connecting surface (11) provided electronic component and a contacted to the device contact substrate (26) with at least a second connecting surface (25), said first is provided pad with a bump (10) having a marginal elevation (15) and surrounded in one of the edge elevation and to a head end of the bump is open towards displacement space (18) at least a displacement pin (16) and the second connecting surface in a contact area (31) formed with the first fitting surface a by displacement of a contact material (29) of the second pad in the displacement space, surrounding the displacement pin Kontaktwulst (30), directed with a bottom (17) of the displacement chamber and against a the Kontaktb rea surrounding planar contact surface (32) of the second pad increased Wulstkrone (33).