Three‐dimensionally braided carbon fiber–epoxy composites, a new type of material for osteosynthesis devices. I. Mechanical properties and moisture absorption behavior
2002
In recent years, three-dimensionally (3D) braided composites have attracted a great deal of attention because of their high-impact damage tolerance and fatigue life, superior fracture toughness, and so forth, and have been used in aeronautics, military, and transportation. These advantages make them strong candidates for osteosynthesis devices. In this study, 3D braided carbon fiber–epoxy (C3D/EP) composites were produced via a simple vacuum impregnation technique. The load-deflection curve, mechanical properties, and influence of fiber volume fraction, braiding angle, and axial reinforcing fibers were examined to determine their suitability for internal fixation devices. It is found that the C3D/EP composites have excellent toughness and do not show brittleness when fractured because of their relatively high void content. The flexural, shear, and impact strengths of the C3D/EP composites are excellent. It was shown that a C3D/EP composite with a stiffness similar to load-bearing bones can be made while maintaining enough strength. It is concluded that a relatively higher void content and braiding angle is more suitable for the C3D/EP composites from the viewpoint of requirements of fracture fixation materials. The moisture absorption behavior and changes in mechanical properties caused by moisture uptake were evaluated. Results show that absorbed moisture slightly decreases mechanical properties of the C3D/EP composites. Contrary to the unreinforced epoxy, the moisture absorption behavior of the C3D/EP composites cannot be described with Fick's law of diffusion, probably because of the presence of voids and/or 3D fiber structure. The exact mechanisms should be proposed in further investigations. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 1031–1039, 2002
Keywords:
- Correction
- Source
- Cite
- Save
- Machine Reading By IdeaReader
27
References
27
Citations
NaN
KQI