The method of manufacturing a semiconductor device, a semiconductor device and a camera assembly

The present invention provides a semiconductor device manufacturing method, semiconductor device and camera assembly. According to an embodiment, on the surface, the back surface and the side surface of the first substrate, forming an insulating film. Subsequently, removing the insulating film surface side of the first substrate, forming an adhesive layer on the surface of the insulating film is removed first substrate. Then, the adhesive spacer layer, the first substrate and the second substrate bonded together.