Electroless deposition of nickel conductive patterns using nickel-ion catalysts

In this article, conductive nickel patterns were constructed on flexible substrates via selectively electroless deposition method, which including four procedures, namely KH550-modification, Ni 2+ adsorption, selective Ni 0 -seeding and Ni-lines deposition. Herein, we use KH550 as a bridge for the catalyst and the surface of substrates, and Ni 0 as catalyst to replace the traditional Pd catalyst. In this way, the conductive circuit can be prepared by adding method on the surface of the flexible substrate and suitable for large-scale production.